DOE Releases Cost Model for Manufacturing of LED Packages

September 7, 2012

The U.S. Department of Energy has released a common cost model for the manufacturing of LED packages. Developed by a DOE working group in response to feedback from previous DOE workshops and roundtables, the Modular LED Cost Model (LEDCOM) provides a simplified method for analyzing the manufacturing costs of an LED package.

The model focuses on the major cost elements and includes preliminary raw data and manufacturing process flow, which provide a starting point and can be customized by the user to model different processes, materials, and equipment. The tool enables those involved in the manufacturing of LED packages – from material and equipment suppliers, to epitaxy growers, to wafer processors, to chip manufacturers and packagers – to evaluate the relative impact of changes made at different points in the manufacturing process on the final LED package cost. It can also be used to help complete a cost-benefit analysis in order to quantify the value of a proposed R&D activity by analyzing the impact the anticipated improvements would have on the final LED package cost. The cost model can be configured to evaluate the impact of changes to the substrate size and type, the fabrication process, raw materials costs, and the manufacturing equipment used.

Find out more, or download the LEDCOM tool.