U. S. Patent Awarded for Rapid Solidification Process (RSP) Tooling

August 11, 2004

The Rapid Solidification Process (RSP) Tooling was recently awarded its fourth patent for its production process for its energy-efficient production process to manufacture die, mold, and related tooling in the metals industry. Developed by the Idaho National Engineering and Environmental Laboratory (INEEL) with DOE support, this process involves spraying layers of molten metal, metallic alloys, or polymers onto a three-dimensional pattern and building up the layers into a full-size die. (PDF 121 KB) Download Acrobat Reader.

This method circumvents the majority of fabrication steps in conventional die-making techniques, such as machining, benching and heat treatment, thus saving energy, cost, and production time. The process also results in a very uniform microstructure of the material, producing dies that last approximately 20% longer than conventional, machined dies. In 2002, the technology was licensed for commercial use by RSP Tooling LLC, formed specifically to develop and market the tooling process.

In addition to the patents, the RSP Tooling has also received an R&D 100 Award, an Energy @23 Award, and a Federal Laboratory Consortium Award.

For more information, contact:

Dr. Kevin M. McHugh, kmm4@inel.gov, Ph: 208-525-5713